Taiwan Stock Exchange · 2330
Taiwan Semiconductor Manufacturing Co., Ltd. price
Price history, key statistics, and comparable assets for Taiwan Semiconductor Manufacturing Co., Ltd..
TWD 2,370.00
+0.21% (TWD 5.00)
Historical prices
Price history
Intraday through long-term closing prices. Choose 1 day, 1 week, 1 month, 6 months, year to date, 1 year, 5 years, or all available history.
Point-in-time fields
Key statistics
- Previous close
- TWD 2,365.00
- Open
- TWD 2,390.00
- Day range
- TWD 2,355.00 to TWD 2,395.00
- 52-week range
- TWD 1,135.00 to TWD 2,535.00
- Volume
- 2287萬
- Average volume
- 4030.17萬
- Market cap
- 61.46兆
- P/E ratio (TTM)
- 27.47
Profile
About Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd. trades on Taiwan Stock Exchange under 2330 and is grouped under Electronic Technology. Figures marked unavailable are not estimated.
Editorial profile
Taiwan Semiconductor Manufacturing Co., Ltd. overview
Taiwan Semiconductor Manufacturing Co., Ltd. manufactures integrated circuits for customers as a dedicated semiconductor foundry. It provides process technologies, design enablement, wafer manufacturing, advanced packaging, and testing support for chip companies. These activities place the company in Electronic Technology and connect 2330 to the specific products, services, customers, and operating assets described in its official materials.
SourcesTaiwan Semiconductor Manufacturing Co., Ltd.2330 is the ordinary share quoted on Taiwan Stock Exchange. Taiwan Semiconductor Manufacturing Co., Ltd.'s investor materials publish quarterly results and an annual report. This profile refers to that local security and operating group, which matters when an issuer has several venues, share classes, depositary receipts, or a name that resembles another company.
SourcesTaiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.A genuinely distinguishing feature is that TSMC's pure-play foundry model means it manufactures customer designs without marketing a competing portfolio of branded end-product chips. Its Open Innovation Platform links process technology with design tools, intellectual property, and packaging partners. This is more precise than a broad sector label: it identifies a named platform, product architecture, network, asset base, or corporate structure that separates Taiwan Semiconductor Manufacturing Co., Ltd. from otherwise similar issuers.
SourcesTaiwan Semiconductor Manufacturing Co., Ltd.- Security type
- Ordinary Share
- Primary listing
- Taiwan Stock Exchange · 2330 SourcesTaiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.
Primary sources
- Taiwan Semiconductor Manufacturing Co., Ltd. official company profileTaiwan Semiconductor Manufacturing Co., Ltd. · Retrieved 2026-08-10
- Taiwan Semiconductor Manufacturing Co., Ltd. investor relationsTaiwan Semiconductor Manufacturing Co., Ltd. · Retrieved 2026-08-10
- 2330 listing informationTaiwan Semiconductor Manufacturing Co., Ltd. · Retrieved 2026-08-10
Contextual peers
Related assets
Same sector: Electronic Technology
2330 questions
Taiwan Semiconductor Manufacturing Co., Ltd. questions
What business does 2330 represent?
2330 represents Taiwan Semiconductor Manufacturing Co., Ltd., which manufactures integrated circuits for customers as a dedicated semiconductor foundry. It provides process technologies, design enablement, wafer manufacturing, advanced packaging, and testing support for chip companies.
Which products, services, or operating markets are specifically associated with 2330?
It provides process technologies, design enablement, wafer manufacturing, advanced packaging, and testing support for chip companies.
What specifically distinguishes the business behind 2330?
For Taiwan Semiconductor Manufacturing Co., Ltd., the asset-specific distinction is that TSMC's pure-play foundry model means it manufactures customer designs without marketing a competing portfolio of branded end-product chips. Its Open Innovation Platform links process technology with design tools, intellectual property, and packaging partners.
Risk and data disclosure
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